Ceramic substrate relates to a specific method where the copper foil is directly connected to the outside, single side or double side of alumina or aluminium nitride ceramic substrate at high heat. As compared to regular FR-4 or aluminium substrate, the ultra-thin composite substrate produces high-quality electrical insulation performance, great thermal conductivity, super easy solderability and great adhesion durability. Also, it can be carved different graphics such as the PCB, with great current carrying capability. It is appropriate for products that generate high heat, and its superior weather stability is extra suitable for severe outdoor conditions.
Types of Ceramic Substrates: -
According to the material: -
- Al2O3: The alumina is the most frequently utilized substrate element in electronics manufacturing. Due to its manufacturing, thermal, and electrical features compared to other oxide ceramics, it has high intensity and chemical durability as well as it is productive in raw elements. It is suitable for different technical construction and various forms.
- BeO: It has a more powerful thermal conductivity than metal aluminium. Also, it is used in purposes that demand high thermal conductivity, but the heat drops quickly. The most significant concern is that its toxicity defines its expansion.
- AlN: AlN has significant properties; one is great thermal conductivity, and the second is the development coefficient matching Si. The main difficulty is that it will influence the thermal conductivity, even if there is a very thin oxide coating on the surface. By rigidly managing the materials and processes, it can produce an AlN substrate with good compatibility.
According to the above reasons, it can be discovered that alumina ceramics are still in a commanding situation in the ranges of microelectronics, power electronics, hybrid microelectronics, and power modules because of their better performance, and wide usage.
According to the making method:
- HTCC: HTCC is also named high temperature co-fired multi-layer ceramic. The manufacturing process is very similar to low-temperature co-fired Ceramic. The foremost difference is that HTCC's ceramic particles are not blended with glass elements. Hence, HTCC must be drained and fixed at a high temperature. Because of its high co-firing temperature, the variety of metal conductor elements is insufficient.
- LTCC: LTCC is also described as low temperature co-fired multilayer ceramic substrate. This technology needs initial mix inorganic alumina powder with up to 50% of glass material with an organic binder to make it regularly combined.
- DBC: Direct bonded copper technology uses copper's oxygen-containing eutectic solution to instantly insert copper on the ceramic. The fundamental principle is to add a proper quantity of oxygen within copper and ceramic before or throughout the removal process.
Besides, direct plate copper and laser activation metallization are two more types of ceramic substrates.
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